CNC Machining for Semiconductors

Precision, cleanliness, and traceability for semiconductor manufacturing components. We provide tight tolerances and cleanroom-capable processes for critical wafer-handling and vacuum parts.

Our advantages

Why Choose RuoChen Precision for Semiconductors

We combine micron-level accuracy with clean manufacturing and full traceability.

  • Quality Control

    ISO-aligned inspection, SPC, and first-article reports ensure micron-level tolerances and repeatability.

  • High-Precision Equipment

    5-axis milling, micro-turning, and in-process probing achieve sub-10 µm repeatability for critical features.

  • Engineering Support

    DFM reviews, prototype iterations, and custom fixtures speed integration with fab and OEM systems.

  • Traceability & Delivery

    Lot-level traceability, material certificates, and controlled shipping meet ESD and cleanroom requirements.

Application Areas

Semiconductors Application Areas

    Typical components we machine for fabs, equipment OEMs, and metrology systems.


    • Wafer handling arms and end-effectors
    • Vacuum flanges, feedthroughs, and ports
    • Chucks, electrostatic clamps, and wafer platens
    • Motion stage blocks, rails, and encoder mounts
    • Optical mounts, alignment pins, and lens holders
    • Gas delivery manifolds, fittings, and valves
    • Probe card housings, probe heads, and sockets
    • Custom precision fixtures and metrology adapters
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application

Typical Parts for Semiconductors

  • Vacuum Flanges & Feedthroughs

    CF/ISO flanges, custom electrical and fluid feedthroughs machined to vacuum and leak-rate specifications.

    304L/316L stainless, Inconel, ceramic-metal assemblies
  • Wafer Handling Components

    End-effectors, grippers, and robotic interface parts with tight concentricity and controlled surface finish.

    7075-T6 aluminum, 6061, PEEK, stainless steel
  • Stage & Motion Components

    Precision stage blocks, spindle housings, and encoder mounts with tight flatness and form control.

    Aluminum alloys, hardened stainless, tool steels, Invar
process

Our Service Process

  • Blueprint
  • Setup
  • Production
  • Finishing
  • Delivery
  • Blueprint

    Ultra-Precision & Cleanliness Review

    We analyze semiconductor drawings with a focus on flatness, Ra, and cleanliness requirements for vacuum and wafer-handling components. Materials and tolerances are checked against fab conditions.

    • Review flatness, parallelism, and Ra requirements
    • Confirm materials suitable for vacuum and cleanroom use
  • Setup

    Clean-Oriented CNC & Metrology Planning

    CNC programs and fixtures are prepared to minimize clamping marks and contamination. We also define metrology plans for tight form tolerances and surface finish checks.

    • Fixtures designed for minimal contact and easy cleaning
    • Metrology plans for flatness, parallelism, and Ra
  • Production

    Micron-Level Machining for Fab Components

    Semiconductor parts are machined on high-precision equipment with in-process probing and measurement. We control micron-level tolerances and surface finishes needed for vacuum and motion stages.

    • In-process probing for critical surfaces
    • Stable machining for vacuum flanges and wafer stages
  • Finishing

    Polishing & Cleanroom-Compatible Treatment

    Components receive electropolishing, passivation, or hard anodizing as specified. Surfaces are refined for low outgassing and easy cleaning, then pass strict inspection.

    • Controlled surface treatments for vacuum and gas systems
    • Inspection of Ra and surface defects under bright lighting
  • Delivery

    Clean Pack & Full Traceability for Fabs

    Finished components are cleaned, double-bagged or sealed as required, and labeled with full traceability information. Packaging and shipping follow your cleanroom and ESD requirements.

    • Cleanroom-style packaging and labeling
    • Documentation attached for material and process history
Services

Our Machining Capabilities

We provide end-to-end CNC machining services to support your project from prototype to mass production.

Material

Materials & Surface Treatment

We machine metals, engineered plastics, and ceramics chosen for low outgassing, thermal stability, and corrosion resistance. Finishes are specified for conductivity, cleanliness, and tight Ra requirements.

  • Material selection for fab environments: stainless steels, aluminum alloys, Invar, PEEK, and technical ceramics for low outgassing.
  • Finishing options include electropolish, passivation, hard anodize, nickel/immersion silver plating, and precision polishing to meet cleanliness and Ra specs.
Discuss Your Project

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